Reach InformationAccording to REACH 1907/2006/EC Article 33 substances identified as candidates for Annex XIV of REACH Regulation have to be named. The substance(s) listed below may be contained in this product above the threshold level of 0.1% by weight.
CAS Number | CAS Name | Weight percentage | Sub Component |
11120-22-2 |
Silicic acid, lead salt |
80.0 |
19_Glass |
11120-22-2 |
Silicic acid, lead salt |
80.0 |
22_Glass |
11120-22-2 |
Silicic acid, lead salt |
80.0 |
ELECTRODE-1-2 |
11120-22-2 |
Silicic acid, lead salt |
80.0 |
Glass_22 |
1303-86-2 |
Diboron-trioxide |
15.0 |
Base(Hermetic Glass) |
1303-86-2 |
Diboron-trioxide |
4.8 |
Sealing Glass |
1317-36-8 |
Lead-monoxide |
1.5 |
INSIDE TERMINATION 1 |
1317-36-8 |
Lead-monoxide |
1.5 |
INSIDE TERMINATION 2 |
1317-36-8 |
Lead-monoxide |
49.3 |
OVERCOAT FILM |
1317-36-8 |
Lead-monoxide |
25.0 |
RESISTIVE FILM |
1317-36-8 |
Lead-monoxide |
25.0 |
RPC05_2 Resistive film_6 |
1317-36-8 |
Lead-monoxide |
49.3 |
RPC05_3 Overcoat film_10 |
1317-36-8 |
Lead-monoxide |
49.3 |
RPC10T0R0_3 Overcoat film_10 |
1317-36-8 |
Lead-monoxide |
25.0 |
RPZ10_2 Resistive film_6 |
1317-36-8 |
Lead-monoxide |
49.3 |
RPZ10_3 Overcoat film_10 |
1317-36-8 |
Lead-monoxide |
62.6 |
Sealing Glass |
7439-92-1 |
Lead |
92.4 |
DIE ATTACHMENT |
7439-92-1 |
Lead |
95.5 |
DIE ATTACHMENT |
7439-92-1 |
Lead |
93.5 |
DIE BONDING MATERIAL |
7439-92-1 |
Lead |
92.5 |
Die Attach Adhesive |
7439-92-1 |
Lead |
95.0 |
INTERNAL SOLDER |
7439-92-1 |
Lead |
95.0 |
SOLDER |